Laser Drilling

Summary

  • 26 Companies
  • 53 Patents
  • 27 Use Cases
  • 3 Case Studies
  • 419 Science Papers
  • Total Funding

Companies

#Organisation NameIndustriesHeadquarterDescriptionFounded YearCompany TypeNum of Employees
1
Engineering
Colne, Lancashire
ELE Advanced Technologies provides manufacturing services for the Aerospace, Industrial Gas Turbine and Automotive markets, with a wide range of manufacturing capabilities including grinding, viper grinding, STEM, laser drilling, capillary drilling, milling, turning, ECM, Laser, EDM ,NDT, welding and honing with a speciality of manufacturing complex components out of nickel based alloys. Our main HQ and factory is in Colne, Lancashire and we have a second manufacturing plant in Slovakia.
2000
Privately Held
113
2
Machinery
Deggendorf, Deutschland
The GFH GmbH is one of the global leaders and technology pioneer in designing and engineering of high precision laser micro machines with ultrafast lasers. One of the focus areas lays within the continuous development of the "tool"​ called laser. Nowadays, the laser technology is already applied for different types of processing, with lowest tolerance and no deterioration, such as: micro cutting, laser turning, laser drilling, micro structuring and micro engraving. As a result, the laser technology of GFH does not only improve the productivity of serial production but also lays the foundation for innovative production methods and future production demands. In addition we offer a professional job shop where our clients needs are met. This production takes place in our company building with our own inhouse manufactured laser micro machines. Series- and special machines under one roof Considered the wide range of productional tasks our portfolio of laser workstations does contain various types of serial production solutions which can be individualized easily and effectively. This allows us to shorten delivery times and ensure optimal production results as well as a high planning certainty for our clients. For very specific needs, we can draw on many years of experience in building special machines. This allows us to build a unique workstation for the customers requirements catalogue. Focus area The term of laser micro machining includes a wide range of different processing techniques which constantly extends. Our area of focus lies within the following field of tasks: Laser drilling, Laser cutting, Engraving and Laserturning.
1998
Sole Proprietorship
65
3
Engineering
Collegno, Piedmont
Prima Industrie heads a leading Group in developing, manufacturing and marketing of laser systems for industrial applications, sheet metal processing machinery, industrial electronics, laser sources, and additive manufacturing solutions. The parent company, Prima Industrie S.p.A., is listed on the Italian Stock Exchange since 1999 (MTA–STAR segment). With over 40 years of experience, the Group has installed more than 30,000 machines in more than 80 countries worldwide and is among the leading global manufacturers in its market. The Group employs over 1,800 people and has manufacturing sites in Italy (Prima Industrie S.p.A., Prima Electro S.p.A., Finn-Power Italia Srl), Finland (Finn-Power Oy), China (Prima Power Suzhou Co. Ltd.) and the US (Prima Electro North America Llc., Prima Power Laserdyne Llc.), as well as a worldwide commercial and after-sales presence. The Prima Industrie Group is organized into three Divisions: – Prima Power, developing, manufacturing and marketing laser and sheet metal working machinery: 2D and 3D laser machines, laser drilling systems, punching & combi machines and systems, bending machines. – Prima Electro, developing, manufacturing and marketing embedded electronics, motion controls and CNCs, high-power laser sources. – Prima Additive, developing, manufacturing and marketing additive manufacturing solutions with both Powder Bed Fusion and Laser Metal Deposition technologies.
-
Public Company
276
4
Manufacturing
TONGYUAN TECHNOLOGY was established in 2002. It is located in Huizhou city in Guangdong Province. Our company has global famous brand equipment and experienced professional technical team. Italy CEDAL press machine, Japanese Mitsubishi Laser drilling machine, Japanese Hitachi drilling machine, Korea TEASUNG equipment, HK Universe lever equipment and VCP, Orbtech AOI and Screen AOI etc. The total amount of capital: 60 million U.S. dollars, the factory covers an area of 50000 square meters, construction area: 48000, production capacity: 100000 square meters per month, 1200000 square meters per year, through the certification: ISO9001 / ISO14001/ TS16949/ UL/ CUL/ ISO13485/ QC080000; won the Guangdong clean production enterprises, high-tech enterprises in Guangdong, Huizhou advanced export unit of honor the title.
2005
Sole Proprietorship
141
5
Pharmaceuticals
Moorestown, NJ
For nearly 50 years, Ackley Machine Corporation has earned its reputation as the global the leader in pharmaceutical printing, laser writing, laser drilling and vision inspection machinery. Known for superior engineering and cutting-edge innovation, Ackley provides leading brands and start ups with custom-engineered solutions to mark tablets, caplets, softgel capsules, hard-shell capsules and LCT’s. Ackley specializes in precision offset rotogravure ink printing machines and CO2 laser marking/drilling machines for pharmaceutical and nutraceutical bulk products. From small batch machines for R&D to high speed, large-scale production machinery, all Ackley machines are FDA and CE compliant and follow cGMP requirements. Vision Inspection with single tablet rejection, Ink Maintenance systems, NIR Inspection Systems, and ancillary equipment such as Bulk Hopper Feeders, Ink mixers and Tablet Sorters are also available. With 1,000+ machines in over 50 countries, Ackley provides the highest level of service and support to customers across the globe.
1976
Privately Held
15
6
Engineering
Westford, MA
Accumet is the name you can trust for all your critical material processing and laser machining requirements. We not only offer some of the most innovative techniques to achieve the most precise tolerances and highest performance—we invented them—starting back in 1970. We pioneered a variety of now 100% proven techniques for lapping, polishing, diamond sawing, laser drilling, cutting, rotary marking, ablation, and welding that have become defacto industry processes. We supply a variety of medical and bioscience, RF/microwave and microelectronics, aerospace and defense manufacturers from two facilities just north of Boston, Massachusetts. Accumet provides a one-stop, unified point-of-contact for a multitude of project and program requirements. We will stock your custom ceramic substrates, metals, tubes, foils, adhesives, frozen epoxies, plastics, RF absorbers, EMI materials, etc., and will also provide valued-added secondary processing and assembly services to help optimize your supply chain. Our customers are located throughout the U.S.A. from Massachusetts, New Hampshire, Connecticut, New York, New Jersey, Pennsylvania and Florida, to Texas, Colorado, Northern and Southern California, Washington, and Oregon. Materials and parts can be made to nearly any size or shape, and with a variety of surface finishes. Accumet’s secondary capabilities include od/id grinding, tumbling, mechanical assembly, painting, packaging, and delivery services. You can also tap into our filled-via planarity process to reduce back and forth shipments for various steps in your circuit manufacturing process. From prototyping to long-term design-for-manufacturability of your particular project, our engineering team will support you every step of the way.
1970
Privately Held
37
7
Engineering
Glen Arm, Maryland
For over 35 years, Lenox Laser has specialized in precision laser drilling of small holes, slits, and shapes in a wide variety of substrates. Flow control orifices are available in standard Swagelok® fittings, as well as custom applications – with holes ranging from the thousands of microns, down to 0.5 micron. These orifices can be calibrated to NIST(National Institute of Standards and Technology) traceable standards, and are designed to perform at a specified flow rate. In 2009, we unveiled several new lasers, expanding our precision drilling and marking capabilities. Our enhanced laser marking facilities incorporate ultra-fast, ultra-precise lasers and software. Laser marking is possible in a wide range of materials and thicknesses and are available for custom applications. We have processed silicon, titanium, stainless steel, nickel, polycarbonates, and other materials. In addition to our laser drilling of microholes, Lenox Laser also laser processes custom projects. The personal goal and commitment of each member of the Lenox Laser Corporation’s engineering team is to provide our customers with reliable and robust products made to specified custom requirements and conditions, such as, high energy light beam densities, aggressive chemical and biological environments, mechanical stresses and vibrations, aerospace and underwater uses, etc. We have a wide range of tools at our disposal. Our lasers range from CW(continuous wave) to picoseconds in pulse widths, from far IR(infrared) to hard UV(ultraviolet) wavelengths, from Joules to micro-Joules in laser beam energy. We can drill to a specified gas or liquid flow or to a specific light intensity depending on the application and specifications of the project.
-
Privately Held
24
8
-
Philadelphia, PA
Founded in 1880, the R.W. Hartnett Company is the world's original manufacturer of pharmaceutical and confectionary printing machines. In 1945, R.W. Hartnett was commissioned by the Ford Gum Company to create a machine to print on their line of gumballs. The printer was a huge success and we quickly found our niche manufacturing the highest-quality printers for the pharmaceutical and confectionary industries. We have machines that will suit all of your pharma and candy printing needs. Our printers are capable of printing on tablets, capsules, softgels, lentils and more. We also specialize in laser drilling and laser etching. Our machinery and products reside in over 40 countries worldwide. All of our machines are manufactured in the United States in our warehouse in Philadelphia, PA.
1880
Privately Held
11
9
Defense and Space
Camarillo, CA
Established In 1990, we specialize in precision thin material fabrication, machining and rapid prototyping using laser technology. Rache Corporation offers thin material laser fabrication (cutting, welding, drilling, stitching, marking and deep engraving) for many industries including RF/microwave, aviation & aerospace, medical device, automotive, defense and commercial electronics. Our proprietary laser fabrication process allows us to accommodate projects (up to 0.090” thick) that require tight tolerances and complex geometries without the need for special tooling. Rapid Prototypes •Working directly from your CAD files allows us to deliver parts within 48 hours (in many cases) •Design validation and pilot production •Quickly accommodate rapid design changes •Simultaneously fabricate multiple design variations •Shorten product development cycle •Quickly identify and resolve manufacturing issues to minimize production costs •Facilitate Design for Manufacturability (DFM) process to ensure a smooth transition into production Processes •Laser Cutting •Laser Welding and Weld Joint Design •Laser Drilling •Laser Stitching and Hand Forming •Laser Marking and Deep Engraving •Helium Leak Testing •Standard and custom parts from small run prototypes to production quantities •Laser Stitching to provide the exact bend location for Hand Forming Engineering Services •Development phase value added design including mechanical, quality and pre-production configuration management Certifications/Standards Organizations •Certified International Society of Configuration Management •Certified ITT Value Based Six Sigma (VBSS) Green Belt Certification - CEU 4.0 - University of Michigan •AS9100 & ISO 9001:2015 Certified •NIST 800-171 Compliant •ITAR Registered Nearly any metal can be cut including gold, silver, platinum, titanium, Kovar, brass, copper, aluminum, stainless steel, super alloys, acrylics, Teflon, Delrin, Kapton, gasket material and many others.
1990
Privately Held
11
10
Manufacturing
Who we are NSI is an innovative company dedicated to laser micromachining products. We build our systems using only state-of-the-art components. Whether for prototyping or mass production, NSI is dedicated to provide laser drilling machines which operate with high speed and precision. At NSI, we strive to meet our customers’ needs, and although we so far have a limited amount of installations, our sole focus on laser micromachining makes NSI unique in the industry. Most machines have been supplied to the PCB manufacturers driving towards higher density and small-diameter interlayer connection holes. Laser Technology NSI covers a wide range with both UV and CO2 laser processing solutions. In combination with a large working area (28”x32”), our systems offer laser micromachining for drilling through holes, blind holes, via, etching, scribing, skiving, and routing. Service and Support Nationwide service and support for products within warranty. Please contact our technical support staff to arrange calibration and preventative maintenance services.
2014
Privately Held
3

Patents

#NumberTitleAbstractDateKindAssigneeInventor
1
10 632 568
Laser beam energy modification to reduce back-wall strikes during laser drilling
Systems and methods for laser drilling provide laser beam energy modification to reduce (e.g., eliminate or minimize) back-wall strikes during laser drilling. The systems and methods modify the process laser beam energy such that a beam energy at a central region of the process laser beam is less than a beam energy at an outer region of the process laser beam. In one example, the modified process beam has zero beam energy at the central region, thereby providing a “donut mode.” The laser beam energy modification may be achieved by detuning a fiber coupler in the Z axis such that laser energy is coupled into a cladding layer of the process fiber coupled to the laser fiber via the fiber coupler.
B2
IPG PHOTONICS CORPORATION
Steven R. Maynard
2
10 480 249
Hybrid mechanical-laser drilling equipment
Systems and methods for utilizing hybrid mechanical-laser drilling tools, such as drill bits and hole-openers, are provided. Such drilling tools may include mechanical cutters in addition to laser cutting mechanisms designed to focus laser beams toward a subterranean formation. The mechanical cutters and laser cutting mechanisms may work in combination to advance a wellbore through the subterranean formation. The drilling tools may be controlled to vary the amount of energy output through the mechanical drilling via the cutters and through the laser-assisted drilling via the lasers.
B2
Halliburton Energy Services, Inc.
Aniket, Robello Samuel
3
10 300 559
Laser drilling method and apparatus with radiation output changes in a radial direction during drilling of a workpiece
A laser drilling method is a laser drilling method for performing drilling on a workpiece by use of a laser beam. The laser drilling method includes, after machining a through hole by radiating the laser beam to the workpiece (S100), scanning with the laser beam centered around the through hole toward a radial direction while changing a radiation output of the laser beam (S200).
B2
TOYOTA JIDOSHA KABUSHIKI KAISHA
Natsuki Sugiyama, Kenji Kidera, Akio Sato, Masaru Setodoi, Mitsutaka Yoshida, Taku Yamaguchi
4
10 306 760
Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method
A method of fabricating a substrate core structure comprises: providing first and second patterned conductive layers defining openings therein on each side of a starting insulating layer; providing a first and a second supplemental insulating layers onto respective ones of a first and a second patterned conductive layer; laser drilling a set of via openings extending through at least some of the conductive layer openings of the first and second patterned conductive layers; filling the set of via openings with a conductive material to provide a set of conductive vias; and providing a first and a second supplemental patterned conductive layer onto respective ones of the first and the second supplemental insulating layers, the set of conductive vias contacting the first supplemental patterned conductive layer at one side thereof, and the second supplemental patterned conductive layer at another side thereof.
B2
Intel Corporation
Islam Salama, Hamid Azimi, Yonggang Li, Charan Gurumurthy
5
10 221 086
Laser drilling method and laser drilling system
The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO2 laser beam, aligning the CO2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.
B2
BOE TECHNOLOGY GROUP CO., LTD., HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
Weigang Gong, Yang Huang, Dai Dong, Sheng Tao
6
10 212 814
Copper foil provided with carrier foil, manufacturing method of the copper foil provided with carrier foil, and copper clad laminate for laser drilling manufactured by using the copper foil provided with carrier foil
An object of the present invention is to improve the laser drilling performance of a copper clad laminate whose black-oxide treated surface is used as a laser drilled surface. To achieve the object, a copper foil provided with a carrier foil 1 comprising a layer structure of the carrier foil 2/the releasing layer 3/the bulk copper layer 4 characterized in that metal element-containing particles 5 are disposed between the releasing layer 3 and the bulk copper layer 4 is employed. If the present copper foil provided with a carrier foil is used, a black-oxide treated layer having a color tone excellent in the laser drilling performance can be formed on the surface of the bulk copper layer in the copper clad laminate manufactured.
B2
MITSUI MINING & SMELTING CO., LTD.
Kazuhiro Yoshikawa
7
10 017 380
Combined laser drilling and the plasma etch method for the production of a micromechanical device and a micromechanical device
A micromechanical device that includes a first substrate, at least one first cavity, and a sealed inlet to the first cavity, the inlet extending through the first substrate. The inlet includes a laser-drilled first subsection and a plasma-etched second subsection, the plasma-etched second subsection having an opening to the first cavity, and the inlet in the first subsection being sealed by a molten seal made of molten mass of at least the first substrate. A combined laser drilling and plasma etching method for manufacturing micromechanical devices is also described.
B1
ROBERT BOSCH GMBH
Jochen Reinmuth, Jan-Peter Stadler
8
9 931 712
Laser drilling and trepanning device
Laser drilling devices are disclosed which include a laser beam source and a laser drilling head. The laser drilling head includes a beam manipulator system in which the only dynamically moving optical element is a mirror. The mirror is dynamically and reciprocally translatable along the direction of the incoming laser beam and is also dynamically and reciprocally tiltable about an axis that is perpendicular to the nominal optical axis of the drilling head. The drilling head also includes a spinnable laser beam rotating system, a simplified compensation system, and a focusing system. The compensation system includes as its only laser beam path shifting optical elements one or two wedge plates which, if two, are fixably rotatable relative to one another in planes which are perpendicular to the nominal optical axis of the laser drilling device.
B2
PIM Snow Leopard Inc.
Weimin Wang
9
9 691 681
Laser drilling encapsulated semiconductor die to expose electrical connection therein
A method of making an integrated circuit package that contains a semiconductor die having one or more electrical connections to an electronic circuit within the semiconductor die. The method may include: encapsulating the semiconductor die and its electrical connections in non-electrically conductive, encapsulation material; laser drilling the encapsulation material to expose one of the electrical connections within the integrated circuit package, thereby creating a via opening in an external surface of the encapsulation material to the electrical connection; and electroplating or sputtering over the via opening in the encapsulation material to create a conductive routing layer from the exterior surface of the encapsulation material to the electrical connection.
B2
LINEAR TECHNOLOGY CORPORATION
Edward William Olsen
10
9 677 338
Device for laser drilling
A device for laser drilling, having: (a) a laser module (310), having a plurality of laser subsystems (200), each one of the laser subsystems (200) having an active optical fiber (240), wound in a shape of hollow coil and packaged inside a hollow cylindrical box (210), and at least one diode laser (220) mechanically connected perpendicularly to the hollow cylindrical box (210) and optically coupled to the core of the active optical fiber (240) wound and packaged inside the hollow cylindrical box (210), the laser module (310) having a tubular shape allowing cooling and drilling fluids to flow through the concentric hollow cores of the tubular laser module (310) and of the cylindrical box (210); and (b) an optical drill head (100), the optical drill head having an end (130) with orifices (110 and 120), and a body (140).
B2
FACULDADES CATÓLICAS, ASSOCIACÃO SEM FINS LUCRATIVOS, MANTENEDORA DA PONTIFÍCIA UNIVERSIDADE CATÓLICA DO RIO DE JANEIRO-PUC-RIO
Cicero Martelli, Arthur Martins Barbosa Braga

Patents by Year

Inventors

Assignees

Assignees

Science

Data limited by 2021

Top 10 cited papers

#Paper TitlePaper AbstractAuthorsFields of StudyYearCitation Count
1
Laser drilling velocity in metals
To describe the laser drilling process, a theoretical model that includes expulsion of liquid material is developed. The model allows the calculation of drilling velocity and drilling efficiency as a function of the absorbed intensity. The same quantities were determined experimentally, using Nd‐YAG‐laser pulses of rectangular shape. Good agreement between measurement and calculation was found in the intensity region where efficient drilling is possible, i.e., where reflection losses and vapor absorption can be neglected. For most metals this region is between 1 and 100 MW/cm2.
Physics, Materials Science
1976
224
2
Femtosecond and picosecond laser drilling of metals at high repetition rates and average powers.
The influence of pulse duration on the laser drilling of metals at repetition rates of up to 1 MHz and average powers of up to 70 W has been experimentally investigated using an ytterbium-doped-fiber chirped-pulse amplification system with pulses from 800 fs to 19 ps. At a few hundred kilohertz particle shielding causes an increase in the number of pulses for breakthrough, depending on the pulse energy and duration. At higher repetition rates, the heat accumulation effect overbalances particle shielding, but significant melt ejection affects the hole quality. Using femtosecond pulses, heat accumulation starts at higher repetition rates, and the ablation efficiency is higher compared with picosecond pulses.
Physics, Materials Science, Medicine
2009
163
3
Laser drilling mechanics
Many laser drilling applications require that the shape of the drilled hole be carefully controlled. In order to successfully do this it is necessary to understand the laser drilling process. This paper reports on a quantitative model which predicts the depth and shape of a hole drilled in alumina ceramic by a ruby laser. Both experimental and theoretical results indicate that the predominant drilling mechanism for this application is not one of surface absorption and conduction inward, but one in which laser energy is absorbed throughout the bulk of the ceramic. The depth and shape of holes drilled in ceramic have been accurately predicted from the measured beam energy density distribution. Finally, it is shown that the radiation pressure of the focused beam plays an important role in the romoval of molten material from the heated region.
Materials Science
1974
76
4
An analytical model for the laser drilling of metals with absorption within the vapour
A mathematical model for the laser drilling of metals is given for the cases of constant and pulsed laser sources. Attenuation of the laser beam within the vapour is considered through an averaged absorption coefficient . The experimentally observed logarithmic dependence of the hole depth on the laser energy is predicted theoretically. A singular perturbation technique is used in order to find solutions valid for different regimes of time, namely pre-vaporization and post-vaporization times. Uniformly valid solutions are found for the one-dimensional analysis of the drilling-front position and speed by matching the inner and outer solutions. First-order approximations for the time-dependent hole profile for the various laser source profiles considered are also found. The model is compared with experimental data in the literature for the drilling speed of copper. An additional set of experiments is specifically carried out to allow comparison with the theoretical hole profiles for titanium. The predictions of the model are found to agree well with the experiments.
Physics, Chemistry
1999
74
5
Review on laser drilling I. Fundamentals, modeling, and simulation
High peak power lasers have been used for years for ablating matter. The most relevant application of this process is laser marking. Marking meets the demands of applications although the quality of ablation has potential to be further improved. However, the qualitative results of the ablation process especially for highly efficient removal of matter in the liquid phase like drilling have not met the standards of alternative processes—the latter is only the case in niches. On the other hand, the ablation by ultrafast lasers in the pulse regime of ps or below, which might meet the quality demands in terms of geometric precision, was too slow for economically feasible application because of the lack of average power. In fact, both process domains have been developed substantially and thus lead to a technological level which make them ready for industrial innovations. In a series of three articles on laser drilling—from fundamentals to application technology—the results of more than a decade of research and ...
Materials Science
2013
69
6
Mechanisms of laser drilling of metal plates underwater
Several metal plates with different thickness including copper, iron, aluminum, and stainless steel have been drilled in the surroundings of air and water, respectively, by a Q-switched pulsed Nd:yttrium–aluminum–garnet laser. It is observed that for the same metal plate less energy is needed to drill a hole in water than that in air, and the surface morphology of hole drilled in water is improved greatly than that in air by comparison of the scanning electron micrographs. The underlying mechanisms behind the efficiency and quality enhancement in water are further investigated by means of optical beam deflection technique. The experimental results show that due to the water confinement the peak amplitude and duration of the laser-ablation-generated impact underwater is much larger than that in air. During the underwater laser drilling, besides laser ablation effect, both the first and second liquid-jet-induced impulses by cavitation bubble collapse in the vicinity of a solid boundary are also observed and...
Physics, Materials Science
2004
61
7
In situ imaging of hole shape evolution in ultrashort pulse laser drilling.
For the first time, in situ the hole shape evolution during ultrashort pulse laser drilling in semiconductor material is imaged. The trans-illumination of the sample at a wavelength of 1.06 µm is projected onto a standard CCD camera during the ablation, providing an image of the contour of the ablated structure perpendicular to the irradiation for drilling. This demonstrated technique enables a direct, high resolution investigation of the temporal evolution of the drilling process in the depth of the material without complex sample preparation or post processing.
Materials Science, Medicine
2010
59
8
Laser drilling of cooling holes in aeroengines: state of the art and future challenges
Abstract Advances in the efficiency of the aeroengine have led to an increase in combustion and exhaust gas temperatures. Although superalloys have been developed to withstand these high temperatures, additional cooling of the components is often necessary. This is achieved through thousands of closely spaced cooling holes drilled into the components. Laser drilling offers economical advantages over other non-conventional drilling techniques (e.g. electrical discharge machining). The key limitations and the areas requiring further investigation to develop the laser drilling process to meet future aeroengine requirements have been identified. Principal areas include the development and investigation of laser barrier methods when drilling through increasingly complicated and smaller cavities, the successful drilling of lower angled effusion holes and the increased use of laser drilling to produce the cooling holes in rotating components. More recent designs of the aeroengine have incorporated thermal barrier coatings, sprayed onto the components to further protect against high temperatures. Successful laser drilling through these coatings, with particular attention to preventing spalling of the coatings also requires more research. Each of these areas will need to be addressed while, at the same time, decreasing the overall drilling times.
Materials Science
2004
55
9
Liquid ejection and possible nucleate boiling mechanisms in relation to the laser drilling process
The laser drilling process is a complex phenomenon. This is especially true after the evaporation process starts. It is experimentally evident that liquid ejection occurs due to drag forces developed around the solid cavity and/or explosion resulting from nucleation of vapour bubbles in the liquid zone. Therefore, study into the ejection of liquid due to vapour bubble formation is necessary. Consequently, the present study examines the liquid ejection mechanism experimentally and possible saturated nucleate boiling is treated theoretically. In the experimental study, streak photography is introduced while a kinetic theory is adopted for the heat transfer model. This enables us to obtain the surface and internal temperature rise due to the laser heating pulse. It is found that the time measured for the liquid expulsion from the heated zone is identical with the time computed corresponding to possible saturated nucleate boiling.
Physics, Engineering
1997
52
10
Analytical investigations on geometrical influences on laser drilling
An analytical model for laser drilling is proposed which includes three-dimensional heat conduction in a simplified manner. For that purpose, the heating of the curved surface is locally described by that of a spherical cavity with comparable curvature within an infinite medium. Additionally, the absorption of laser radiation on the inclined side wall is taken into account. Using these components, it is possible to calculate the evolution of the hole shape from pulse-to-pulse in an iterative way. Therefore, this model is suitable to study the main aspects of deep drilling such as ablation rates and hole shapes without the disadvantage of long computational times. As a drilled hole deepens and the walls become steeper, its surface area grows and, thereby, in principle the absorbed intensity drops. This can lead to a considerable reduction of ablation rate. At the same time, extremely curved surface areas will heat much faster or slower than plane ones which, again, results in local changes of drilling velocity. It is shown that the former is particularly of interest for the description of the resulting hole shape while the latter has a considerable influence on the ablation velocity at the tip of the hole. To verify the analytical model, its results are compared with those of three-dimensional numerical simulations. It is shown that the simplified assumptions introduced here are, up to some extent, suitable to explain the final surface shapes for blind holes as well as the experimentally observed dependence of ablation rate on hole depth.
Physics, Chemistry
2001
40

Top 10 cited authors

#AuthorPapers countCitation Count
1
7
574
2
4
428
3
17
393
4
11
378
5
4
371
6
5
371
7
3
369
8
20
293
9
14
285
10
3
252

Science papers by Year

Clinical Trials

  • Researches Count 0
  • Ongoing Studies 0
  • Total Enrollment

Use Cases

#TopicPaper TitleYearFields of studyCitationsUse CaseAuthors
1
Laser Drilling
Through Mold Via Development Using Laser Drilling Process for 3D Fan-out Wafer Level Package
2021
0
through mold via development
2
Laser Drilling
Material synthesis, characterization and performance measurement of laser drilling for stir casted Cu-Ni-Tib2 metal matrix
2020
Materials Science
1
stir casted cu-ni-tib2 metal matrix
3
Laser Drilling
Optimization of Exit Diameter of Hole on Ti-6Al-4V Superalloy Using Laser Drilling
2020
Materials Science
0
optimization of exit diameter of hole on ti-6al-4v superalloy
4
Laser Drilling
Dual‐Responsive Janus Membrane by One‐Step Laser Drilling for Underwater Bubble Selective Capture and Repelling
2019
Materials Science
9
underwater bubble selective capture and repelling
5
Laser Drilling
Microhole‐Arrayed PDMS with Controllable Wettability Gradient by One‐Step Femtosecond Laser Drilling for Ultrafast Underwater Bubble Unidirectional Self‐Transport
2019
Materials Science
30
ultrafast underwater bubble unidirectional self‐transport
6
Laser Drilling
Parameter Optimization of CO2 Laser Drilling for Different Features
2018
0
different features
7
Laser Drilling
Enhanced Photocatalytic Activity of WS2 Film by Laser Drilling to Produce Porous WS2/WO3 Heterostructure
2017
Materials Science, Chemistry, Medicine
24
produce porous ws2/wo3 heterostructure
8
Laser Drilling
Ultrasound-assisted pulsed laser drilling for fabricating high quality microholes
2017
Materials Science
3
fabricating high quality microholes
9
Laser Drilling
Water-assisted laser drilling for miniature internal thread in glass and evaluation of its strength
2017
Physics, Materials Science
6
miniature internal thread in glass and evaluation of its strength
10
Laser Drilling
Fabrication of through-hole membranes by laser drilling for discharging UV-curable liquids in UV nanoimprint lithography
2016
Materials Science, Environmental Science
0
discharging uv-curable liquids in uv nanoimprint lithography

Case Studies

#TitleDescriptionPDFYearSource Ranking
1
Case Study: Laser Drilling (Chapter 4) - Industrial Mathematics
Industrial Mathematics - December 2001.
no
8 800
2
Laser Drilling Case Study - GB Innomech
A manufacturing automation system capable of producing 5 million injection capsules per year and providing total traceability of each capsule produced.
no
0
3
Page 1 - Laserline-Case-Study-Laser-cladding-for-the-drilling-industry
The advantage of laser cladding compared to conventional hardfacing, like plasma transfer arc (PTA) welding is the reduction of heat input and reduction of ...
no
10

Experts

Youtube Channels

#NameDescriptionReg DateViewsCountry
1
HGTECH possesses HGLASER and FARLEYLASERLAB brands. HGLASER has always been committed to providing broad and comprehensive laser manufacturing solutions in industrial manufacturing field, researching, manufacturing and selling various laser processing and plasma machining equipments, providing tube laser cutting processing and oil pipeline trade services. The main products of HGLASER cover the full power series of laser cutting systems, laser welding systems, laser marking series, laser texturing equipments, laser heat treatment systems, laser drilling machines, laser devices, all kinds of support devices, laser processing and plasma machining equipments, which are used widely in metallurgy, non-ferrous metals, automobiles, parts, aviation, military, precision instruments, machine manufacturing, hardware, integrated circuits, semiconductor manufacturing, solar, education, communication and measurement, packaging, leathers, plastics, rubbers, jewelries, crafts, medical equipments, etc.
Mon, 29 Aug 2016
3 449 084
2
This channel shows the latest technology in CNC plasma, laser, drilling and combination process plate cutting and structural steel processing machinery.
Thu, 15 Mar 2012
329 645
Canada